Innovation Forum on
“Signal Processing and Artificial Intelligence: Challenges and Opportunities”

Thursday, April 19, 16:00-18:00, Macleod D lecture hall

Signal Processing and Artificial Intelligence have led to major advances in a wide range of areas such as speech recognition, image analysis, and self-driving cars. The future promises many exciting advances that will benefit society. How do we get there? This Forum will examine this broad topic by beginning with several short, point-of-view presentations on SP & AI challenges and opportunities given by leaders in the field, followed by a panel discussion. Join us as we examine this topic from various perspectives including academia and industry, research and applications, cloud-based and mobile devices, human and machines.

Co-organized by John Apostolopoulos, Rico Malvar, Pascale Fung.

Particpants

Prof. Yann LeCun

Prof. Yann LeCun

Prof. Yann LeCun, Director of AI Research at Facebook and Silver Professor at New York University, ICASSP 2018 Plenary Speaker

Dr. Luc Vincent

Dr. Luc Vincent

Dr. Luc Vincent, Vice President of Engineering at Lyft, ICASSP 2018 Plenary Speaker

Prof. Pascale Fung

Prof. Pascale Fung

Prof. Pascale Fung, Professor at Hong Kong University of Science and Technology (HKUST), and Director of Centre for AI Research (CAiRE), Technical co-chair of ICASSP 2018

Dr. Mike Polley

Dr. Mike Polley

Dr. Mike Polley, Senior Vice President of Mobile Processor Innovation Lab (MPI), Samsung Research America, and Vice-chair, Industry DSP Technology Standing Committee

Prof. Paris Smaragdis

Prof. Paris Smaragdis

Prof. Paris Smaragdis, Associate Professor at University of Illinois at Urbana-Champaign, and Senior Research Scientist at Adobe Research. Former chair of IEEE Machine Learning for Signal Processing Technical Committee.

Moderator: Dr. John Apostolopoulos

Dr. John Apostolopoulos

Moderator: Dr. John Apostolopoulos, Chief Technology Officer & Vice President, Enterprise Networking, Lab Director for Cisco Innovation Labs, Cisco. Former Chair of IEEE Image, Video, and Multidimensional Signal Processing Technical Committee.